DIACENTER is the computer system for the automated centering of diamonds.
As is known, mechanical bruting demands exact centering of diamonds on the bruting equipment.
DIACENTER allows to achieve very exact centering, that considerably reduces losses of stone weight and raises quality of finished polished diamonds.
The centering is performed by moving and shifting a diamond along the pot till the hardening of the adhesive.

DIACENTER also has diamonds analysis opportunities, because it is based on DIAVISION - our diamonds analysis system.
It can do:
  • Automated diamonds centering
  • Rough diamonds planning
  • The analysis of diamonds for optimization of a polished diamonds cut
  • The analysis of inclusions in diamonds
  • Calculation of the diamond sawing process
  • Measuring and evaluating a polished diamonds cut
  • Diamond cut grading in accordance with GIA and AGS diamond-grading systems

Thus, DIACENTER can be used not only for automated laser diamonds centering, but also for performing an expert evaluation of rough diamonds, for diamond cut planning and controlling, and for final quality control of polished diamonds.

DIACENTER is irreplaceable tool for any diamond-cutting enterprise.


DIACENTER consists of a measuring unit with the diamond-centering device, power supply and personal computer.
The diamond-centering device is a micrometer screw with an engine.


Software is based on the algorithm creating a three-dimensional digital model of a rough diamonds surface and inclusions with its consequent three-dimensional analysis. The algorithm of analysis defines the optimal way of cutting the specific rough diamond within the specified set of diamond cuts and selects the best parameters for them, taking into consideration the crystallographic axis orientation.
As optimization criteria are taken the maximal weight and maximal value of the predicted polished diamonds.

The process of diamond cut planning can be performed with different automation degrees - from the interactive mode, where an operator manually prepares a plan of marking to fully automated planning of diamond cut.
The evaluation of a polished diamond being planned is made on the basis of the user-defined price-list in accordance with the following four parameters: weight, color, clarity and cut. The predicted color is set by an operator.

The ready plan of a diamond-cutting process consists of:
  • Description of each planned polished diamond, according to its geometrical and quality parameters
  • Sawing and polishing charts with the indication of polishing direction or grain and facet angles
  • General data, such as the yield, value and weight

All designed variants of processing of a stone can be saved in a database for subsequent use.


Centering accuracy 1.25 mkm
Centering time 30 s

Weight of analyzed rough diamonds 1–25 carat
Analysis time 30 s

Weight of polished diamonds to be tested 0.1–15.0 carat
Testing time 15 s
Linear accuracy ±0.01 mm
Angular accuracy ±0.2°
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